3M 5515-20 Thermally Conductive Silicone Interface Pad

3M 5515-20 Thermally Conductive Silicone Interface Pad

Product Description 3M™ Thermally Conductive Silicone Interface Pad 5515 is designed to provide a preferential heat transfer path between heat generating components and cooling devices for applications with a thin thickness (0.2-0.25 mm) requirement
Applications IC Packaging Thermal Interface Material (TIM) LED board TIM Printed Circuit Board heat sink TIM HD TV Address IC Chip and Scan Module Aluminum heat sink block Thin gap filling between boards, modules and chassis’ COF chip heat conduction to adjacent substrate
Feature 1 Good thermal conductivity (3.0 W/m-K)
Feature 2 Hardness: Shore 00 = 80
Feature 3 Good dielectric properties
Feature 4 UL 94 Flammability Rating V-0
Feature 5 High temperature resistance
Feature 6 Good converting for complicated shapes
Feature 7 Good flexibility with over bending
Feature 8 Thin thickness for lower thermal impedance
Feature 9 Slight tack allows pre-assembly
Feature 10 Pre-cut shapes save time, money and reduce waste

Total Thickness 7.9 mils
Material/Backing Removable PE or PET Film
Backing Thickness N/A
Flame Retardant Yes
High Initial Adhesion N/A
Low Static N/A
Electrically Conductive N/A
Thermally Conductive Yes
High Temperature Yes
UL Printed UL 94 V-0
UNSPSC N/A
Standards / Specifications UL 94 V-0
Country of Origin N/A
Origin Criterion N/A
Certification Indicator N/A
Qualification Method N/A
Cage Code 4AJG6
ECCN Number EAR99

Storage Condition Humidity Controlled Storage (16C/60F TO 27C/80F & 40-60%RH)
Shelf Life N/A
Return Policy 25% restocking fee
RoHS Status N/A
REACH Status n/a
Prop 65 Compliance n/a
CMRT n/a