3M 8926-025 Thermally Conductive Interface Tape

3M 8926-025 Thermally Conductive Interface Tape

Applications Heat management, general heat dissipation, joining/bonding parts
General heat sink bonding
IC chip packaging heat conduction
Printed circuit board
LED module/board bonding
Flat panel display assembly (e.g. LCD and PDP devices)
COF chip heat conduction
Feature 1 Good thermal conductivity (>1.5W/m-K)
Feature 2 Excellent dielectric performance
Feature 3 Low thermal impedance
Feature 4 Good and reliable adhesion performance to Al and SS
Feature 5 Vibration damping
Feature 6 UL 94 Flammability Rating V-0
Feature 7 Thin PET carrier designed for good converting ability, handling and re-workability
Feature 8 Can be die-cut with exact dimensions to meet footprint of user's lighting or electronic component design

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