3M 3305 - 3M Wafer De-Taping Tape
Translucent polyester film tape with aggressive rubber adhesive specifically designed to remove polyolefinic surface protection tapes such as silicon wafer backgrinding tape. Can also remove general purpose tapes.  | Color | Transparent | | Tape Structure (Backing/Adhesive) | Polyimide/Rubber | | Backing Thickness mils (mm) | 1.6 (0.04) | | Total Thickness mils (mm) | 2.7 (0.07) | | Adhesion to Steel oz./in. (N/100 mm) | 120 (131) | | Tensile Strength lbs./in. (N/100 mm) | 43 (753) | | Elongation at Break % | 180 | | Temperature Range °F (°C) | -40 to 200°F (4 to 93° C) | | Comments | De-taping applications. |
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